Microstructure of lead-free solder bumps using laser reflow soldering
نویسندگان
چکیده
منابع مشابه
Lead-free Solder Assembly
Until non-lead solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble solder pastes that were tested varied widely. Ultimately each company will need to determine which attributes are most important for their product line. Also components needed for a product may not be currently available as lea...
متن کاملThe Impact of Reflowing A Pbfree Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity
The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfr...
متن کاملSolder doped polycaprolactone scaffold enables reproducible laser tissue soldering.
BACKGROUND AND OBJECTIVES In this in vitro feasibility study we analyzed tissue fusion using bovine serum albumin (BSA) and Indocyanine green (ICG) doped polycaprolactone (PCL) scaffolds in combination with a diode laser as energy source while focusing on the influence of irradiation power and albumin concentration on the resulting tensile strength and induced tissue damage. MATERIALS AND MET...
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ژورنال
عنوان ژورنال: IOP Conference Series: Materials Science and Engineering
سال: 2014
ISSN: 1757-8981,1757-899X
DOI: 10.1088/1757-899x/61/1/012038